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會員專屬活動-先進微系統與構裝技術聯盟(AMPA)會議
積體電路封裝實務簡介 & 專利之侵權鑑定與迴避設計
「走過金融海嘯,從2010 CES聚焦ICT產業趨勢」...
「3D IC技術趨勢-由技術研發邁向商品化應用」研討...
Designing and Modeling for Power Integrity – State of...
會員專屬活動-先進微系統與構裝技術聯盟(AMPA)會議
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Seiko Epson發表最多可連接4台類比攝影機之車用介面IC
NEC大幅增產USB 3.0控制晶片,月產量將達200...
DRAM記憶晶片之缺貨可能已迫在眉睫
2009年度全球微機電晶片市場規模縮減5%
未來五年全球太陽能產業被看好將高度成長
Intel推出125美元之40GB SSD產品
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2009 IMPACT---Call For Paper
IMPACT 2009 as one of the most remarkable conference in packaging and PCB areas expects the theme, “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”, to bring together researchers, engineers and experts to Taiwan and share current progress and exciting advanced technologies applying in near future...
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